Mission and vision
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Mission
Our mission is to supply the best possible micro tooling technology to the semiconductor industry and replace the conventional mechanical sawing used in wafer dicing, and so help our customers to get significant benefits by increasing throughput and enabling the use of latest materials and technology.
Vision
We believe that within the next few years laser-based systems will replace traditional mechanical sawing in thin wafer dicing due to faster operating speed, superior cutting quality and increased capacity. Ultra-short pulse fiber laser technology is the best possible solution for thin wafer grooving and dicing. Our vision is to become the market leader in wafer dicing within the next three years.